A liquid cooling system is a thermal management technology that uses liquid as a cooling medium to dissipate heat generated by electronic devices or mechanical components through fluid circulation. Compared with traditional air cooling, liquid cooling offers significantly higher heat capacity and thermal conductivity, making it a critical solution for handling high-density, high-power thermal loads. Our company provides a wide range of piping and valve components as well as integrated solutions for cooling systems across multiple industries, including data centers, large-scale power distribution cabinets, electronic equipment, medical devices, frequency conversion equipment, energy storage systems, radar systems, and many other fields.
Information Technologies
Processors (microprocessors) generate waste heat during operation. This results in overheating of the unit, which can cause malfunction even to the point of destruction of components. A cooling system is then mandatory to guarantee the rapid dissipation of the waste heat.
Small dissipation areas and high temperatures demand optimized and highly efficient solutions. As liquid is 10 times more efficient than air, we provide support to our customers to build complete systems for water cooling for high performance computers,data centers,microelectronics and telecomunication applications.
Seal Information
| Seal | Material Code | Temperature (℃) | Characteristics |
|---|---|---|---|
| EPDM | EA917-70 | -55 to 120 | Low compression set, media compatibility (deionized water / glycol solution / propylene glycol solution, etc.), low silicon leaching |
| E0667-70 | -50 to 121 | Low compression set, media compatibility (deionized water / glycol solution / propylene glycol solution, etc.) | |
| E7736-70 | -50 to 105 | Low compression set, media compatibility (deionized water / glycol solution / propylene glycol solution, etc.), UL certified | |
| Silicone / VMQ (ASTM) | WE830-50 | -50 to 204 | Low compression set, media compatibility (deionized water / glycol solution / propylene glycol solution, etc.) |
| SW935-35 | -50 to 121 | Low compression set, media compatibility (deionized water / glycol solution / propylene glycol solution, etc.), low silicon leaching | |
| HNBR | KA158-70 | -40 to 149 | Resistant to refrigerant, media compatibility (deionized water / glycol solution / propylene glycol solution, etc.) |
| KB161-70 | -31 to 149/162 | Resistant to refrigerant, suitable for O-rings, extruded profiles, PIP, custom parts | |
| CR | C0873-70 | -37 to 107 | Resistant to refrigerant |
| FKM | VM530-75 | -25 to 204 | Low compression set, suitable for O-rings and extruded profiles |
| V0747-75 | -25 to 204 | General purpose material, low compression set, suitable for O-rings and custom parts |
